Rudolph AXi940 Inline Wafer Inspection Tool
₹22,000,000.00
Rudolph AXi940 Inline Wafer Inspection Tool
Article number:DV10120
Manufacturer:Rudolph
Manufacturer number:AXi940
Type:Inline Wafer Inspection Tool
YoM:2010
Condition:Used
Location
Schweiz
SchweizAvailability:as of 06/2025
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Product Details
Rudolph Technologies / Onto Innovation automatic inline wafer inspection tool AXi 940 b
Model: AXi940b
Operating hours lamp: <8.000h
Year of manufacture: 07/2010
Technical data:
AXi-940b:
200-240V AC
50/60Hz
6A
WHS220:
208-240V AC
50/60Hz
max. 20A
110psi
Features:
o Loading connections for 6 and 8 inch wafers
o Handler, robot and prealigner internal
o Lenses 1x 2x 5x 10x 20x
o Internal barcode reader
o Inspection camera b/w
o Colour review camera
o Frontsite and clustersite computer (WIN7)
o Software Version 3.9.4.18
Accessories:
Documentation
General information about the system:
The Rudolph AXi940 is an automated macro inspection system specifically designed for front side inspection of semiconductor wafers. The system was introduced by Rudolph Technologies (now part of Onto Innovation) and is part of the ‘Explorer Inspection Cluster’ - a modular platform for inspecting multiple wafer surfaces.
Inspection area:
The AXi940 is designed for macroscopic inspection of the wafer front surface and is primarily used to detect macro defects.
Software:
The system features a modernised user interface designed to reduce operating costs through increased productivity, higher system reliability and minimised operator interaction.
Automation:
Integrated, intelligent software supports the automatic creation of inspection recipes. This significantly reduces the time required and the need for manual intervention by the operator.
System integration:
The AXi940 can be fully integrated into the Explorer Inspection Cluster as a module. It can be operated offline for recipe creation while parallel production processes in other modules continue undisturbed.
Installation dimensions:
approx. 2x1.5x2m
Commissioning:
Commissioning of the system can be organised by the manufacturer through us and carried out on your premises for an additional charge. Simply ask us about this.
Maintenance:
The system was last serviced in 2024.
Professional maintenance of the system can optionally be carried out by the manufacturer. This service is subject to a charge and can be ordered and organised through us.
Upgrading the wafer size:
A professional upgrade of the wafer size can optionally be carried out by the manufacturer. This service is subject to a charge and can be ordered and organised through us.
Model: AXi940b
Operating hours lamp: <8.000h
Year of manufacture: 07/2010
Technical data:
AXi-940b:
200-240V AC
50/60Hz
6A
WHS220:
208-240V AC
50/60Hz
max. 20A
110psi
Features:
o Loading connections for 6 and 8 inch wafers
o Handler, robot and prealigner internal
o Lenses 1x 2x 5x 10x 20x
o Internal barcode reader
o Inspection camera b/w
o Colour review camera
o Frontsite and clustersite computer (WIN7)
o Software Version 3.9.4.18
Accessories:
Documentation
General information about the system:
The Rudolph AXi940 is an automated macro inspection system specifically designed for front side inspection of semiconductor wafers. The system was introduced by Rudolph Technologies (now part of Onto Innovation) and is part of the ‘Explorer Inspection Cluster’ - a modular platform for inspecting multiple wafer surfaces.
Inspection area:
The AXi940 is designed for macroscopic inspection of the wafer front surface and is primarily used to detect macro defects.
Software:
The system features a modernised user interface designed to reduce operating costs through increased productivity, higher system reliability and minimised operator interaction.
Automation:
Integrated, intelligent software supports the automatic creation of inspection recipes. This significantly reduces the time required and the need for manual intervention by the operator.
System integration:
The AXi940 can be fully integrated into the Explorer Inspection Cluster as a module. It can be operated offline for recipe creation while parallel production processes in other modules continue undisturbed.
Installation dimensions:
approx. 2x1.5x2m
Commissioning:
Commissioning of the system can be organised by the manufacturer through us and carried out on your premises for an additional charge. Simply ask us about this.
Maintenance:
The system was last serviced in 2024.
Professional maintenance of the system can optionally be carried out by the manufacturer. This service is subject to a charge and can be ordered and organised through us.
Upgrading the wafer size:
A professional upgrade of the wafer size can optionally be carried out by the manufacturer. This service is subject to a charge and can be ordered and organised through us.
